NANOG Meeting Presentation Abstract

DOCSIS 3.1 High Level Overview
Meeting:	NANOG59
Date / Time:	2013-10-09 10:30am - 11:00am
Room:	Akimel Ballroom 3 & 4
Presenters:	Speakers: Karthik Sundaresan, CableLabs Karthik Sundaresan is a Lead Architect at CableLabs, and is responsible for the development and architecture of cable access network technologies. He is the technical lead and contributor to various DOCSIS technology specifications and has focused on MAC layer protocols, Quality of Service, IP Multicast, IPv6, eDOCSIS, eRouter, L2VPN, and Modular Headend Architectures. He is also involved in the development of the DOCSIS® Provisioning of EPON (DPoE™) Specifications. Previously, he worked with Conexant Systems developing hardware designs for MPEG encoders, analog video decoders and DOCSIS cable modem chips. He also worked with Carrier Access Corp developing embedded software for next-generation IP/Telecom networking equipment. Karthik holds a Bachelor of Engineering and a Master of Science in Electrical Engineering from the University of Colorado, Boulder, and also holds (ISC2) CISSP certifications. He is the past Chair of the IEEE Communications Society, Denver Chapter.
Abstract:	This presentation will give a high level overview of the new technologies being defined in the upcoming DOCSIS 3.1 specification. Starting from the overall requirements and business goals, the presentation will describe the technical direction of this next stage of evolution in DOCSIS access networks. It will touch upon the PHY layer where new technologies such as Orthogonal Frequency Division Multiplexing (OFDM) and new LDPC Forward Error Correction have been chosen. The DOCSIS 3.1 MAC layer has been updated in order to accommodate all the underlying changes in the PHY technology and also introduces other new features. The talk will cover some of the benefits of the choices made at both the PHY and MAC layer. It will also touch upon the evolution of the DOCSIS network architecture to accommodate the new DOCSIS 3.1 devices in the near future.
Files:	DOCSIS 3.1 High Level Overview(PDF) DOCSIS 3.1 High Level Overview
Sponsors:	None.

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